Coplanarity tool


















The distance from the offset regression plane to the terminal farthest away from the offset regression plane is the component deviation from coplanarity. Least Mean Square Plane Coplanarity Deviation Lowest Ball Reference Plane parallel to LMS plane Figure 4 — Deviation from coplanarity measurement using regression plane method 6 Failure criteria Any device with one or more terminals that exceeds the specified deviation from coplanarity shall constitute a failure.

This process is usually programmed into the equipment used to measure coplanarity. The algorithm used is typically like the illustration outlined in the next paragraphs. The principle is to determine if the origin lies within the interior of the triangle.

The interior of the triangle is defined as the intersection of three regions: A. If the points determine a vertical line, m is undefined, see paragraph 4. This is done by comparing the sign obtained in step 1 to the sign of the y-intercept of the line. The y-intercept is positive if the origin lies below the line, and vice versa.

When the two signs are multiplied, the result is -1 if the remote point and the origin lie on the same side of the line. This is true if and only if, for each of the three lines, the remote point lies on the same side of the line as the origin. The determination is made in Excel by adding the three comparisons. A -3 result is positive; any other result is negative. Excel displays error messages for m and b, but in the case of a vertical line, these values are not needed or used.

The apexes are sorted by Z, in descending order. If they do not, apex trios are examined in order until a trio is found that determines the seating plane. Since the list is sorted by height, the first trio found that forms a triangle enclosing the origin will define the seating plane. This is done through an equation that is preprogrammed into measurement tool. The deviation from coplanarity is the largest distance from the seating plane to the apex of any terminal.

Total views 3, On Slideshare 0. From embeds 0. Number of embeds 9. Downloads Shares 0. Comments 0. Likes 1. You just clipped your first slide! Clipping is a handy way to collect important slides you want to go back to later.

Now customize the name of a clipboard to store your clips. Visibility Others can see my Clipboard. While the invention has been particularly shown and described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing and other changes in form and details may be made therein without departing from the spirit and scope of the invention.

We claim: 1. An apparatus for determining a coplanarity of electrical leads of a semiconductor device comprising: an image capturing device;.

An apparatus as in claim 1 wherein the at least one mirror comprises four mirrors. An apparatus as in claim 1 wherein the base comprises white nylon material and a light source beneath the top side of the base, the light source illuminating the semiconductor device through the white nylon material. An apparatus as in claim 1 wherein the off-axis angle comprises an angle between 3 degrees and 22 degrees.

An apparatus for determining a coplanarity of electrical leads of a semiconductor device comprising: a camera;. An apparatus as in claim 5 wherein the at least one mirror comprises four mirrors. An apparatus as in claim 5 wherein the base comprises white nylon material and a light source beneath the top side of the base, the light source illuminating the semiconductor device through the white nylon material.

An apparatus as in claim 5 wherein the off-axis angle comprises an angle between 3 degrees and 22 degrees. An apparatus as in claim 9 wherein the at least one mirror comprises four mirrors.

An apparatus as in claim 10 wherein the image capturing device captures an image of a top side of the semiconductor device and further comprising a computer system determining the coplanarity of the leads based upon a distance of a reflected image of the optical datum relative to the reflected image of the semiconductor device leads and for determining the lead skew and tip-offset from the image of the top side of the semiconductor device.

An apparatus as in claim 9 wherein the base comprises white nylon material and a light source beneath the top side of the base, the light source illuminating the semiconductor device through the white nylon material. An apparatus as in claim 9 wherein the optical datum comprises a ring around the base and below the top side of the base. An apparatus as in claim 9 wherein the optical datum comprises a ring having a top portion sloped to a point, the optical datum positioned around the base and below the top side of the base.

An apparatus as in claim 9 further comprising a computer system determining the coplanarity of the leads based upon the distance of the reflected image of the optical datum relative to the reflected image of the semiconductor device leads. An apparatus for determining coplanarity of electrical leads of a semiconductor device comprising: a camera;.

The apparatus as in claim 16 wherein the optical datum comprises a rings having a top portion sloped to a point, the optical datum positioned around the base and below the top side of the base. The apparatus as in claim 16 wherein the reflected image of the semi-conductor device leads is an off-axis image. A method for determining coplanarity of electrical leads comprising the steps of: capturing an off-axis image of the electrical leads; and.

A method as in claim 19 wherein the image captured is a reflected image of the electrical leads. A method as in claim 20 wherein the image captured further comprises a top side view of the semiconductor device and further comprising the step of computing the tip-offset and lead skew.

A method for determining coplanarity of electrical leads comprising the steps of: providing an optical datum;. The method as in claim 22 wherein the image captured is a reflected image of the electrical leads and the optical datum. A method as in claim 23 wherein the image captured further comprises an top side view of the semiconductor device and further comprising the step of computing the tip-offset and lead skew. USA true USA Continuation USA en.

USB1 en. Apparatus for detecting lead coplanarity, apparatus for detecting condition of electronic component, and system for mounting electronic component. Co-planarity and top-down examination method and optical module for electronic leaded components. Appearance inspecting jig for small parts and inspecting method employing the same jig. Absorbent articles with distribution materials positioned underneath storage material. Surface shape measurement apparatus, surface shape measurement method, surface state graphic apparatus.

USB2 en. Electronic component products made according to a process that includes a method for three dimensional inspection. Method for photographically recording a cylindrical, especially plate-shaped object. Method and an apparatus for measuring positions of contact elements of an electronic component. Multi-view-angle image capturing device and multi-view-angle image inspection apparatus using the same.

Semiconductor device inspection apparatus using a plurality of reflective elements. System for detecting and correcting misalignment of semiconductor package leads.

Part mounting apparatus with single viewing camera viewing part from different directions. Method of manufacturing electronic components including a method for three dimensional inspection. Electronic component products and method of manufacturing electronic component products. Method and apparatus for backlighting and imaging multiple views of isolated features of an object. Method of inspecting an array of solder ball connections of an integrated circuit module.

Machine vision method using search models to find features in three dimensional images. USA1 en. EPA1 en. Method and apparatus for measuring registration between layers of a semiconductor wafer. KRA en. JPHA en. JPA en. JPB2 en. GBA en. CNU en. A simple device for visually inspecting the leads on a formed Gull-wing component.

Using a highly polished, float glass mirror set at a critical angle, the operator places a component on the surface of the tool and looks at the leads in the mirror. This new inspection tool is made of tool steel, and is chrome plated. The mirror is also very effective when used in conjunction with under a microscope or HD video optical inspection devices. Model CI-1 is 4 " x 4. We can customize to fit your needs, for more information, click on the button or contact:. Robert Antonelli rantonelli fancort.

Close menu. Log in.



0コメント

  • 1000 / 1000